Everything You Should Know About PCB Stencils Design Considerations
In PCB stencil design, the thickness of the stencils is a key factor that decides the amount of solder paste to be deposited on the board. Extra solder deposition causes solder bridging, while less solder deposition weakens the solder joints. The size of stencil openings needs to be designed smaller than the PCB pad size which can avoid problems such as bridging and solder beads, or the solder paste may stick to the aperture walls when the stencils are removed